Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

This position will own the mechanical and thermal architecture of the complete liquid cooling system, from chip-level thermal management and cold plate design through server-level coolant distribution, rack manifolds, pumping systems, and rack-level cooling infrastructure. The engineer will drive the development of high-performance, high-reliability liquid cooling solutions capable of supporting extreme thermal densities while maintaining acceptable coolant temperatures, flow rates, pressure drops, mechanical integrity, serviceability, and long-term reliability. The ideal candidate combines deep expertise in thermal engineering, fluid mechanics, heat transfer, liquid cooling system design, and mechanical integration, with a proven track record of delivering complex cooling systems from concept through production.

This role is on-site, based out of Toronto, Canada, Austin, Texas or Santa Clara, California.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

You have a BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related discipline, and 12+ years of experience in thermal engineering, liquid cooling, heat transfer, or advanced mechanical systems.
You have architected and delivered complex liquid cooling systems from concept through production, with deep expertise in fluid mechanics, thermodynamics, heat transfer, and thermal-hydraulic design.
You bring hands-on experience designing and optimizing cold plates, manifolds, pumps, heat exchangers, tubing, and fluid connectors for demanding thermal loads.
You are proficient with CFD and thermal simulation tools such as ANSYS Fluent, Icepak, or CFX, and mechanical CAD tools such as Creo, SolidWorks, or NX; you can also perform system-level flow, pressure-drop, pump-sizing, and heat-transfer calculations.
You are a proven technical leader who can independently drive complex engineering programs, guide multidisciplinary teams, and take designs through validation and production.

What We Need

Architect end-to-end liquid cooling systems for AI racks operating at 400–600 kW, from accelerator cold plates and server coolant distribution through rack manifolds, pumps, CDUs, and facility interfaces.
Develop and qualify chip-level cooling solutions for accelerator packages dissipating 2,000–3,000 W, collaborating across silicon, package, PCB, and mechanical engineering to address hotspots, heat flux, interfaces, and mechanical loading.
Build and validate thermal-hydraulic models and designs, including coolant flow and temperature requirements, pressure drops, flow balancing, pump operating points, CFD analysis, and system operating margins.
Deliver mechanically robust, serviceable rack cooling architectures, defining requirements for coolant selection, materials compatibility, leak prevention and detection, pressure containment, reliability, maintenance, and fault tolerance.
Lead prototyping, testing, supplier engagement, and production implementation—correlating models with test results and delivering validated cooling hardware, CDU interfaces, and rack distribution systems.

What You Will Learn

Establish the liquid cooling technology foundation for next-generation AI systems operating at unprecedented compute and thermal densities.
Shape cooling architecture and technical roadmaps across accelerator packages, servers, racks, CDUs, and datacenter infrastructure.
Work directly with cross-functional engineering teams and cooling suppliers to evaluate emerging technologies and make system-level design decisions.
Take advanced cooling solutions from early architecture and analysis through full-rack validation and production deployment, seeing how your work enables reliable, scalable AI compute.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

Datacenter Liquid Cooling Architect