Highly skilled Semiconductor Equipment Maintenance Professional with hands-on experience supporting advanced back-end assembly and test manufacturing environments. Brings deep expertise maintaining and troubleshooting critical semiconductor equipment including wafer saws, die attach systems, wire bonders, automatic wafer probers, device handlers, and mixed-signal ATE platforms. Combines strong electromechanical aptitude with a proven track record of maximizing equipment uptime, driving process reliability, and supporting high-volume production operations. Well-versed in semiconductor manufacturing best practices, including Mil-STD-883 requirements, Z540 calibration standards, and ESD control procedures. Backed by a solid technical foundation through Electronic Engineering Technology training, military technical experience, or extensive industry expertise, this professional is a trusted resource for ensuring peak equipment performance and operational excellence.

Requirements

Requirements:

• AS/ASEET electronic engineering technology, military training, or 10+ years relevant work experience.
• 5+ years supporting Back-end Assembly/Test equipment (Wafer Saws, Die Attach, Wire Bonders, Automatic Wafer Probers, Device Handlers, and Mixed-Signal ATE.
• Minimum of 5 years’ experience with semiconductor manufacturing in the Equipment Maintenance Field
• Familiarity with Mil-STD 883 methods, Z540 Calibration procedures and ESD practices
• Strong electromechanical skills